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2013 the 3rd International Conference on Mechatronics and Applied Mechanics (ICMAM2013)

Dec.30-31.2013 Paris,France

Photo of 2nd ICMAM2012 at Hong Kong and Taipei

2013 the 3rd International Conference on Mechatronics and Applied Mechanics (ICMAM2013) is being organized and will be held in Paris during Dec.30-31, 2013.

ICMAM is a leading international conference for researchers and industry practitioners to share their new ideas, original research results and practical development experiences from all Mechatronics and Applied Mechanics related areas.

The goal of the 3rd ICMAM2013 is to bring together researchers and scientists with interests in Mechatronics and Applied Mechanics and related issues to address recent research results and to present and discuss their ideas, theories, technologies, applications, work in progress and experiences.

3rd ICMAM2013, co-sponsored by Trans tech publications, Bosi EDU (Professional Organizer for Academic Conferences) is supposed to be the largest technical event on Mechatronics and Applied Mechanics at Paris in 2013.

3rd ICMAM2013 will cover the following research topics:
T1: Manufacturing Technology and Processing
T2:Mechatronics and Automation
T3:Mechatronic and Embedded System Applications
T4:Applied Mechanics And Other topics

All papers both invited and contributed submitted to 3rd ICMAM2013 will be reviewed by two or three experts from the PC. After a careful reviewing process, all accepted paper will be published in international journal “Applied Mechanics and Materials”[ISSN:1660-9336, Trans Tech Publications] “Applied Mechanics and Materials” is indexed by Elsevier. Scospus and Ei Compendex (CPX), Cambridge Scientific Abstracts (CSA) , Chemical Abstracts (CA) , Google and Google Scholar, ISI (ISTP) , Institution of Electrical Engineers(IEE) , etc.(For index information,please refer to AMM official website: http://www.ttp.net/1660-9336.html). The full text is online available via platform www.scientific.net. Trans Tech Publications will provide online camera-ready paper submission system.